Conventional Semiconductors: The top down
approach
Single crystal substrates (e.g., Si, GaAs)
Expensive processing facilities (Billion dollar fabrication plants)
Generally invokes a series of process steps in which a substrate is coated with a photoresist, masked off, developed, etched, vapor doped, and so on ad infinitum.
There are a very limited number of device architectures which have been highly optimized
Despite the complexity silicon based devices are good and arent going away anytime soon.
Conventional devices configurations are applicable to p-conjugated polymers
a)Top-contact
device, with source and drain
electrodes evaporated onto organic
layer.
b)Bottom-contact
device with organic deposited onto source and
drain.
A FET (field effect transistor)